Composite Heat Release Technology Cesa™ Conductive Additives Cesa™ Raise Heat Stability Modifier for APET Packaging

Composite Heat Release Technology Cesa™ Conductive Additives Cesa™ Raise Heat Stability Modifier for APET Packaging

Composite Heat Release Technology Cesa™ Conductive Additives Cesa™ Raise Heat Stability Modifier for APET Packaging

Composite Heat Release Technology Cesa™ Conductive Additives Cesa™ Raise Heat Stability Modifier for APET Packaging

Use a small nozzle orifice to help produce shear heating during injection Overmolded parts will take longer to cool because the TPE is only cooled from one side as the plastic substrate has poor thermal conductivity. Substrate cleanliness, preparation and pre-heating

Use a small nozzle orifice to help produce shear heating during injection Overmolded parts will take longer to cool because the TPE is only cooled from one side as the plastic substrate has poor thermal conductivity. Substrate cleanliness, preparation and pre-heating

Cesa™ Fiber Additives for heat preservation can absorb more heat when exposed to solar rays. Cesa™ Fiber Additives for cool feeling can provide fast heat conduction and moisture absorption, allowing the body to feel cooler and more comfortable.

Reduce energy to the blowing lamps allowing preforms to heat faster b. Increased Throughput: To achieve desired bottle quality, many blow molders will slow the blow speed, giving the preform optimal time to heat before blowing. Bottle Development Process: New developments are conducted using small-scale lab equipment, which serve as excellent molding platforms.

Reduce energy to the blowing lamps allowing preforms to heat faster b. Increased Throughput: To achieve desired bottle quality, many blow molders will slow the blow speed, giving the preform optimal time to heat before blowing. Bottle Development Process: New developments are conducted using small-scale lab equipment, which serve as excellent molding platforms.

In late 2016, PolyOne acquired COMPTEK (Diez, Germany), a specialist in formulations based on extreme-heat polymeric materials such as PEEK, PES, PEI, PPS, PSU and PPSU. Electrical and/or thermal conductivity