Edgetek™ 3D/LDS Solutions Edgetek™ 3D/LDS Solutions - Product Bulletin (Chinese) Edgetek™ 3D/LDS Solutions - Product Bulletin (English)

Homepage // News Center // New Edgetek™ Material from Avient Streamlines Production for 3D MID/LDS Applications in Asia Currently, 3D MIDs with LDS technology are widely used in antennas (consumer electronics), automotive components, medical devices, and 5G base stations. Sectors related to 5G, including infrastructure, will drive future applications that create high demand for 3D MID (LDS) technology and materials.

Edgetek™ 3D/LDS Solutions are the advanced technologies to help customers to build 3D circuits on molded part surfaces with fewer processing steps, shorter lead times and lower production costs. Edgetek 3D/LDS Solutions can be formulated in PC, LCP, PPS and be customized to meet customers’ specific needs. Edgetek™ 3D/LDS Solutions PRODUCT BULLETIN

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MAJOR TELECOM COMPANY L D S A N T E N N A A R R A Y • Required material suitable for Laser Direct Structuring (LDS) for a 3D antenna design that allowed Surface Mount Technology (SMT) for mass production in a short manufacturing time • 265°C /10 seconds • Provided high-heat material to enable miniaturization and multi-function integration for an innovative 3D design • Formulated LDS solution with low dielectric constant (Dk 3.98) and dissipation factor (Df 0.006) values Edgetek™ ET9600-8015 Formulation KEY REQUIREMENTS WHY AVIENT AVIENT SOLUTION DESIGN FREEDOM + SMT LEARN MORE Copyright © 2021, Avient Corporation. https://www.avient.com/products/engineered-polymer-formulations/general-engineered-formulations/edgetek-3d/lds-solutions

Edgetek 3D_LDS Product Bulletin-CN 20200812 Edgetek™ 3D/LDS 解决方案 产品公告 Edgetek™ 3D/LDS解决方案是帮助客户在模塑部件表面 构建3D电路的先进技术⸺加工步骤更少，交付周期更短， 生产成本更低。 Edgetek 3D/LDS解决方案可通过PC、LCP、PPS制造，并可 根据客户的具体需求进行定制。 3D/LDS Edgetek配方可以让高端电子元件制造商缩小机 械和电气系统组件，即使是在高温制造过程中，如表面贴 装工艺（SMT），都可达到减小终端产品尺寸的目的，该配 方可广泛应用于电子、汽车和5G行业及相关基础设施等行 业。

PLA 3D BLUE 2126C PLA 3D PINK #2085 PLA 3D BLUE #2060

Edgetek™ LDS及3D立体电路配方使客户能够在有限空间内实现选择性金属化电路设计。 此种材料有助于提高 设计灵活性，尤其是在3D天线设计和复杂形状方面。 ET9600-8010 LDS ET3200-8177 LDS基础树脂 产品牌号 基础树脂 Dk Df ET9600-8010 LDS BK001 LCP 4 0.006 280+ ℃ ET9600-8015 3D BK001 LCP 3.9 0.004 270+ ℃ ET9600-8018 3D BK001 LCP 3.44 0.004 250+ ℃ ET9600-8022 3D BK001 LCP 3.06 0.004 250+ ℃ ET7600-8047 3D NC001 PPE 2.6 0.002 No ( SMT ) ET7600-8052 3D NC001 PPE 4.5 0.004 No ( SMT ) ET7600-8040 3D RS NC001 PPE 6 0.002 No ( SMT ) ET7600-8043 3D RS NC001 PPE 9 0.004 No ( SMT ) ET3200-8205 3D BK001 PC 2.95 0.006 No ( SMT ) ET3200-8207 3D BK001 PC 2.95 0.006 No ( SMT ) ET3200-8198 3D BK001 PC 3.2 0.006 No ( SMT ) LCP PPE PC 焊接能力 EDGETEK LDS 系列产品：™ 普立万EDGETEK LDS及3D立体电路配方在5G基站天线应用方面具有以下优势： • 提高设计灵活性 ‒ 有助于提高设计灵活性，尤其是在电路设计、3D天线设计和复杂形状方面 • 加快设计确认效率，缩短交货周期 ‒ 可根据特定的Dk值进行定制，并在数周内交付 • 灵活的设计空间 ‒ 有助于优化受空间限制的电路设计 • 与SMT工艺兼容 ‒ 可提供具有耐热性的定制配方，抗热变形温度范围为200℃-278℃ 如需了解更多详情，请访问 www.avient.com 或致电 +86 021 60294888 ， 能可 的数 www.avient.com 版权所有©2020埃万特公司。

Edgetek™ 3D/LDS Solutions - Product Bulletin (Chinese) Advanced technologies to help customers to build 3D circuits on molded part surfaces (Chinese language version) Edgetek™ 3D/LDS Solutions - Product Bulletin (English)