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S E M I C O N D U C TO R PAC K A G IN G O E M S P E C I A L T Y , S T A T I C D I S S I P A T I V E P A C K A G I N G • Provide protection against electrostatic discharge (ESD) and environmental variations • Ensure highly specialized, clean manufacturing conditions • Deliver stringent quality control of ionic and metal contamination • Maintain availability of raw materials across a global supply chain • Ability to translate production globally • Protected critical electronics from ESD while providing an environmental barrier • Adhered to strict quality and cleanliness controls from raw material handling through production to help maintain high-purity standards, such as ultra-clean feeders, deionized water, and specific HVAC systems, supporting quality initiatives, including PCS reviews, eCoA, and HA assessments • Exceeded customer expectations for controlling ionic and metal contamination down to parts per billion (PPB) • Offered global capabilities with local support and material supply to meet growing semiconductor industry needs Stat-Tech Static Dissipative Formulations KEY REQUIREMENTS WHY AVIENT?

BASE RESIN PPA PC PSU PES PPS CO- POLYMER ACETAL PEEK PA Barrel Temperatures* °F (°C) Rear Zone 550–580 (288–305) 520–560 (271–293) 600–640 (316–338) 630–660 (332–338) 550–580 (288–304) 350–370 (177–188) 660–700 (349–371) 440–490 (227–254) Center Zone 560–600 (293–316) 530–570 (277–299) 620–670 (327–354) 650–680 (343–360) 560–615 (293–324) 380–390 (193–200) 700–730 (371–388) 470–510 (243–266) Front Zone 580–620 (304–327) 550–580 (288–305) 630–680 (332–360) 670–730 (354–388) 590–630 (310–332) 390–430 (200–221) 720–750 (382–400) 490–540 (254–282) Nozzle 575–615 (302–324) 550–600 (288–316) 630–680 (332–360) 680–700 (360–371) 600–625 (316–330) 380–415 (193–213) 720–750 (382–400) 520–570 (271–300) Melt Temperature 575–615 (302–324) 560–600 (293–316) 625–675 (330–358) 650–710 (343–377) 600–625 (316–330) 370–410 (188–210) 670–740 (354–393) 520–570 (271–300) Mold Temperature 250–300 (121–150) 175–240 (80–116) 190–300 (88–150) 225–325 (107–164) 250–325 (121–164) 150–225 (66–107) 290–375 (143–190) 150–200 (66–93) Pack & Hold Pressure 50%–75% of Injection Pressure Injection Velocity in/s 1.0–3.0 Back Pressure psi 50 Screw Speed rpm 50–90 Drying Parameters °F (°C) 6 hrs @ 175 (80) 4 hrs @ 250 (121) 4 hrs @ 275 (135) 4 hrs @ 300 (150) 4 hrs @ 250 (121) 2 hrs @ 200 (93) 3 hrs @ 300 (150) 4 hrs @ 180 (82) Allowable Moisture % < 0.05 < 0.02 < 0.02 < 0.04 < 0.02 0.15–0.20 < 0.02 0.10–0.20 Cushion in 0.125–0.250 Screw Compression Ratio 2.5:1–3.5:1 2.0:1–2.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 Nozzle Type General Purpose General Purpose General Purpose General Purpose General Purpose General Purpose General Purpose Reverse Taper Clamp Pressure 5–6 Tons/in2 of projected area of cavities and runner system * Barrel temperatures should be elevated for compounds designed for electrical insulative properties. Cut vent depths to: - PPA Compounds: 0.0015"–0.0025" depth and 0.250" width - PC Compounds: 0.002"–0.004" depth and 0.250" width - PSU Compounds: 0.003"–0.004" depth and 0.250" width - PES Compounds: 0.003"–0.004" depth and 0.250" width - PPS Compounds: 0.002"–0.003" depth and 0.250" width - Acetal Compounds: 0.0015" minimum depth and 0.250" width - PEEK Compounds: 0.002"–0.004" depth and 0.250" width - Nylon Compounds: 0.002" minimum depth and 0.250" width • Increase vent depth to 0.060" (1.5mm) at 0.250" (4.0mm) away from the cavity and vent to atmosphere.

Base Resin PPA PC PSU PES PPS Co- polymer Acetal PEEK PA Barrel Temperatures* °F (°C) Rear Zone 550–580 (288–305) 550–590 (288–310) 600–640 (316–338) 630–660 (332–338) 550–580 (288–304) 350–370 (177–188) 660–700 (349–371) 440–490 (227–254) Center Zone 560–600 (293–316) 570–600 (300–316) 620–670 (327–354) 650–680 (343–360) 560–615 (293–324) 380–390 (193–200) 700–730 (371–388) 470–510 (243–266) Front Zone 580–620 (304–327) 580–630 (304–322) 630–680 (332–360) 670–730 (354–388) 590–630 (310–332) 390–430 (200–221) 720–750 (382–400) 490–540 (254–282) Nozzle 575–615 (302–324) 580–630 (304–322) 630–680 (332–360) 680–700 (360–371) 600–625 (316–330) 380–415 (193–213) 720–750 (382–400) 520–570 (271–300) Melt Temperature 575–615 (302–324) 580–625 (304–330) 625–675 (330–358) 650–710 (343–377) 600–625 (316–330) 370–410 (188–210) 670–740 (354–393) 520–570 (271–300) Mold Temperature 250–300 (121–150) 175–240 (80–116) 190–300 (88–150) 225–325 (107–164) 250–325 (121–164) 190–250 (88–121) 290–375 (143–190) 150–200 (66–93) Pack & Hold Pressure 50%–75% of Injection Pressure Injection Velocity in/s 1.0–3.0 Back Pressure psi 50 Screw Speed rpm 50–90 Drying Parameters °F (°C) 6 hrs @ 175 (80) 4 hrs @ 250 (121) 4 hrs @ 275 (135) 4 hrs @ 250 (121) 3 hrs @ 300 (150) 2 hrs @ 200 (93) 3 hrs @ 275 (135) 4 hrs @ 180 (82) Cushion in 0.125–0.250 Screw Compression Ratio 2.5:1–3.5:1 2.0:1–2.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 Nozzle Type General Purpose General Purpose General Purpose General Purpose General Purpose General Purpose General Purpose Reverse Taper Clamp Pressure 5–6 Tons/in2 of projected area of cavities and runner system * Barrel temperatures should be elevated for compounds designed for electrical insulative properties. Cut vent depths to: - PPA Compounds: 0.0015"–0.0025" depth and 0.250" width - PC Compounds: 0.002"–0.004" depth and 0.250" width - PSU Compounds: 0.003"–0.004" depth and 0.250" width - PES Compounds: 0.003"–0.004" depth and 0.250" width - PPS Compounds: 0.002"–0.003" depth and 0.250" width - Acetal Compounds: 0.0015" minimum depth and 0.250" width - PEEK Compounds: 0.002"–0.004" depth and 0.250" width - Nylon Compounds: 0.002" minimum depth and 0.250" width • Increase vent depth to 0.060" (1.5mm) at 0.250" (4.0mm) away from the cavity and vent to atmosphere.