Pipe Mfg Liquid Color App Snapshot final (1) PIPE MANUFACTURER P R E S S U R E / N O N - P R E S S U R E P I P E S • Provide a safe and compliant manufacturing environment for all team members • Improve weatherability and outdoor exposure longevity in field and yard environments • Increase color consistency and enhance pipe appearance • Reduce scrap rates and eliminate order rejections • Meet required compliance and regulatory approvals • Incur no capital expense for dosing & handling equipment • Provided a customer-centric approach focused on gaining operational efficiencies to support an improved manufacturing environment • Offered formulation expertise and problem-solving experience to upgrade pipe performance • Attained finely dispersed TiO2 and color distribution throughout the pipe, meeting quality requirements while reducing scrap rates • Delivered solutions with extensive NSF, UL and pipe industry approvals • Supplied dosing equipment to eliminate capital costs, backed with on-call technical support ColorMatrix™ Liquid Colorant + Dosing Equipment KEY REQUIREMENTS WHY AVIENT?

CARTWRIGHT Retired President, Bowling Green State University Committees: 1, 4* RICHARD H. Geon’s roots date back to 1927 when BFGoodrich scientist Waldo Semon produced the first usable vinyl polymer. CARTWRIGHT Retired President, Bowling Green State University Committees: 1, 4* RICHARD H.

They’ve put a lot of bulky metal, glass, and stone out of work since they came on the scene in a big way back in the 1950s. Other keys to molding electrically conductive compounds are slow injection speeds and low back pressure (e.g., 50 psi).1 Use 50 percent to 75 percent of the injection pressure for the pack and hold pressure. Mapleston, “The future could be carbon,” Compounding World (Oct. 2016). www.compoundingworld.com

They’ve put a lot of bulky metal, glass, and stone out of work since they came on the scene in a big way back in the 1950s. Other keys to molding electrically conductive compounds are slow injection speeds and low back pressure (e.g., 50 psi).1 Use 50 percent to 75 percent of the injection pressure for the pack and hold pressure. Mapleston, “The future could be carbon,” Compounding World (Oct. 2016). www.compoundingworld.com

They’ve put a lot of bulky metal, glass, and stone out of work since they came on the scene in a big way back in the 1950s. Other keys to molding electrically conductive compounds are slow injection speeds and low back pressure (e.g., 50 psi).1 Use 50 percent to 75 percent of the injection pressure for the pack and hold pressure. Mapleston, “The future could be carbon,” Compounding World (Oct. 2016). www.compoundingworld.com

They’ve put a lot of bulky metal, glass, and stone out of work since they came on the scene in a big way back in the 1950s. Other keys to molding electrically conductive compounds are slow injection speeds and low back pressure (e.g., 50 psi).1 Use 50 percent to 75 percent of the injection pressure for the pack and hold pressure. Mapleston, “The future could be carbon,” Compounding World (Oct. 2016). www.compoundingworld.com

They’ve put a lot of bulky metal, glass, and stone out of work since they came on the scene in a big way back in the 1950s. Other keys to molding electrically conductive compounds are slow injection speeds and low back pressure (e.g., 50 psi).1 Use 50 percent to 75 percent of the injection pressure for the pack and hold pressure. Mapleston, “The future could be carbon,” Compounding World (Oct. 2016). www.compoundingworld.com

They’ve put a lot of bulky metal, glass, and stone out of work since they came on the scene in a big way back in the 1950s. Other keys to molding electrically conductive compounds are slow injection speeds and low back pressure (e.g., 50 psi).1 Use 50 percent to 75 percent of the injection pressure for the pack and hold pressure. Mapleston, “The future could be carbon,” Compounding World (Oct. 2016). www.compoundingworld.com

They’ve put a lot of bulky metal, glass, and stone out of work since they came on the scene in a big way back in the 1950s. Other keys to molding electrically conductive compounds are slow injection speeds and low back pressure (e.g., 50 psi).1 Use 50 percent to 75 percent of the injection pressure for the pack and hold pressure. Mapleston, “The future could be carbon,” Compounding World (Oct. 2016). www.compoundingworld.com

July 1, 2021 1)  Financial information referenced here is provided to aid in reconciling back to the most comparable GAAP figures.