GREEN BASE POST CC2862 KUMHO UV ABS V3 PC APPLE GREEN 370C W/UV

STERLING SILVER ABS GP22 PC GREEN CAP BODY 335U

GREEN PC GREY ABS 104621

GRAY ABS BLENDER GRAY PC

DELL BLUE ABS SILVER ABS 292C BLUE ABS

Base Resin PPA PC PSU PES PPS Co- polymer Acetal PEEK PA Barrel Temperatures* °F (°C) Rear Zone 550–580 (288–305) 550–590 (288–310) 600–640 (316–338) 630–660 (332–338) 550–580 (288–304) 350–370 (177–188) 660–700 (349–371) 440–490 (227–254) Center Zone 560–600 (293–316) 570–600 (300–316) 620–670 (327–354) 650–680 (343–360) 560–615 (293–324) 380–390 (193–200) 700–730 (371–388) 470–510 (243–266) Front Zone 580–620 (304–327) 580–630 (304–322) 630–680 (332–360) 670–730 (354–388) 590–630 (310–332) 390–430 (200–221) 720–750 (382–400) 490–540 (254–282) Nozzle 575–615 (302–324) 580–630 (304–322) 630–680 (332–360) 680–700 (360–371) 600–625 (316–330) 380–415 (193–213) 720–750 (382–400) 520–570 (271–300) Melt Temperature 575–615 (302–324) 580–625 (304–330) 625–675 (330–358) 650–710 (343–377) 600–625 (316–330) 370–410 (188–210) 670–740 (354–393) 520–570 (271–300) Mold Temperature 250–300 (121–150) 175–240 (80–116) 190–300 (88–150) 225–325 (107–164) 250–325 (121–164) 190–250 (88–121) 290–375 (143–190) 150–200 (66–93) Pack & Hold Pressure 50%–75% of Injection Pressure Injection Velocity in/s 1.0–3.0 Back Pressure psi 50 Screw Speed rpm 50–90 Drying Parameters °F (°C) 6 hrs @ 175 (80) 4 hrs @ 250 (121) 4 hrs @ 275 (135) 4 hrs @ 250 (121) 3 hrs @ 300 (150) 2 hrs @ 200 (93) 3 hrs @ 275 (135) 4 hrs @ 180 (82) Cushion in 0.125–0.250 Screw Compression Ratio 2.5:1–3.5:1 2.0:1–2.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 Nozzle Type General Purpose General Purpose General Purpose General Purpose General Purpose General Purpose General Purpose Reverse Taper Clamp Pressure 5–6 Tons/in2 of projected area of cavities and runner system * Barrel temperatures should be elevated for compounds designed for electrical insulative properties. Venting • Place vents at the end of fill and anywhere potential knit/weld lines will occur. • All vents need to be vented to atmosphere. • For circular parts, full perimeter venting is recommended. • Cut vent depths to: - PPA Compounds: 0.0015"–0.0025" depth and 0.250" width - PC Compounds: 0.002"–0.004" depth and 0.250" width - PSU Compounds: 0.003"–0.004" depth and 0.250" width - PES Compounds: 0.003"–0.004" depth and 0.250" width - PPS Compounds: 0.002"–0.003" depth and 0.250" width - Acetal Compounds: 0.0015" minimum depth and 0.250" width - PEEK Compounds: 0.002"–0.004" depth and 0.250" width - Nylon Compounds: 0.002" minimum depth and 0.250" width • Increase vent depth to 0.060" (1.5mm) at 0.250" (4.0mm) away from the cavity and vent to atmosphere.

BASE RESIN PPA PC PSU PES PPS CO- POLYMER ACETAL PEEK PA Barrel Temperatures* °F (°C) Rear Zone 550–580 (288–305) 520–560 (271–293) 600–640 (316–338) 630–660 (332–338) 550–580 (288–304) 350–370 (177–188) 660–700 (349–371) 440–490 (227–254) Center Zone 560–600 (293–316) 530–570 (277–299) 620–670 (327–354) 650–680 (343–360) 560–615 (293–324) 380–390 (193–200) 700–730 (371–388) 470–510 (243–266) Front Zone 580–620 (304–327) 550–580 (288–305) 630–680 (332–360) 670–730 (354–388) 590–630 (310–332) 390–430 (200–221) 720–750 (382–400) 490–540 (254–282) Nozzle 575–615 (302–324) 550–600 (288–316) 630–680 (332–360) 680–700 (360–371) 600–625 (316–330) 380–415 (193–213) 720–750 (382–400) 520–570 (271–300) Melt Temperature 575–615 (302–324) 560–600 (293–316) 625–675 (330–358) 650–710 (343–377) 600–625 (316–330) 370–410 (188–210) 670–740 (354–393) 520–570 (271–300) Mold Temperature 250–300 (121–150) 175–240 (80–116) 190–300 (88–150) 225–325 (107–164) 250–325 (121–164) 150–225 (66–107) 290–375 (143–190) 150–200 (66–93) Pack & Hold Pressure 50%–75% of Injection Pressure Injection Velocity in/s 1.0–3.0 Back Pressure psi 50 Screw Speed rpm 50–90 Drying Parameters °F (°C) 6 hrs @ 175 (80) 4 hrs @ 250 (121) 4 hrs @ 275 (135) 4 hrs @ 300 (150) 4 hrs @ 250 (121) 2 hrs @ 200 (93) 3 hrs @ 300 (150) 4 hrs @ 180 (82) Allowable Moisture % < 0.05 < 0.02 < 0.02 < 0.04 < 0.02 0.15–0.20 < 0.02 0.10–0.20 Cushion in 0.125–0.250 Screw Compression Ratio 2.5:1–3.5:1 2.0:1–2.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 Nozzle Type General Purpose General Purpose General Purpose General Purpose General Purpose General Purpose General Purpose Reverse Taper Clamp Pressure 5–6 Tons/in2 of projected area of cavities and runner system * Barrel temperatures should be elevated for compounds designed for electrical insulative properties. Venting • Place vents at the end of fill and anywhere potential knit/weld lines will occur. • All vents need to be vented to atmosphere. • For circular parts, full perimeter venting is recommended. • Cut vent depths to: - PPA Compounds: 0.0015"–0.0025" depth and 0.250" width - PC Compounds: 0.002"–0.004" depth and 0.250" width - PSU Compounds: 0.003"–0.004" depth and 0.250" width - PES Compounds: 0.003"–0.004" depth and 0.250" width - PPS Compounds: 0.002"–0.003" depth and 0.250" width - Acetal Compounds: 0.0015" minimum depth and 0.250" width - PEEK Compounds: 0.002"–0.004" depth and 0.250" width - Nylon Compounds: 0.002" minimum depth and 0.250" width • Increase vent depth to 0.060" (1.5mm) at 0.250" (4.0mm) away from the cavity and vent to atmosphere.

Superior UV and scratch resistant TPE that meet VIAQ standard, suitable for PC and ABS OM applications. OnFlex-S™ used for overmolding handgrips onto ABS resin

At first, they experimented with pre-colored ABS, but the ABS parts failed the company’s requirements for color retention after exposure to UV light.

SEMICONDUCTOR PACKAGING OEM S P E C I A L T Y , S T A T I C D I S S I P A T I V E P A C K A G I N G • Provide protection against electrostatic discharge (ESD) and environmental variations • Ensure highly specialized, clean manufacturing conditions • Deliver stringent quality control of ionic and metal contamination • Maintain availability of raw materials across a global supply chain • Ability to translate production globally • Protected critical electronics from ESD while providing an environmental barrier • Adhered to strict quality and cleanliness controls from raw material handling through production to help maintain high-purity standards, such as ultra-clean feeders, deionized water, and specific HVAC systems, supporting quality initiatives, including PCS reviews, eCoA, and HA assessments • Exceeded customer expectations for controlling ionic and metal contamination down to parts per billion (PPB) • Offered global capabilities with local support and material supply to meet growing semiconductor industry needs Stat-Tech Static Dissipative Formulations KEY REQUIREMENTS WHY AVIENT?