3D Printing & Rapid Prototyping Substance Safety Summaries

PLA 3D CLAY RED 7621U PLA 3D ROYAL BLUE 293C Substance Safety Summaries

PLA 3D TAN 2311C #2110 PLA 3D MAROON #2103 Substance Safety Summaries

PLA 3D GOLD #117 PLA 3D ANTIQUE GOLD #119 Substance Safety Summaries

3D PURPLE 3D SILVER Substance Safety Summaries

Source: https://pbipolymer.com/ https://www.engineering.com/3DPrinting/3DPrintingArticles/ArticleID/14465/3D-Printing-Filam https://www.engineering.com/3DPrinting/3DPrintingArticles/ArticleID/14465/3D-Printing-Filam https://pbipolymer.com/ Source: https://www.solvay.com/sites/g/files/srpend221/files/2018-11/Additive-Manufacturing-Filaments-Processing-Guide_EN-v1.1_0.pdf BRASS OR STEEL DIE? PROCESSING OPTIONS Additive Manufacturing Many companies are producing 3D printed parts from high-performance polymers for specialized aerospace, medical and industrial applications. These materials can be 3D printed using selective laser sintering (SLS) and fused filament fabrication (FFF).

These materials increase design flexibility, particularly for 3D antenna designs and complex shapes. ET9600-8010 LDS ET3200-8177 LDS Dielectric Constant (DK) 3.98 2.88 Dissipation Factor (Df) 0.0060 0.0040 SPECIALTY ENGINEERED MATERIALS ELECTRICAL & ELECTRONICS SOLUTIONS EDGETEK™ FORMULATIONS FOR 5G BASE STATION ANTENNA APPLICATIONS EDGETEK™ PRODUCT PORTFOLIO HOW AVIENT EDGETEK FORMULATIONS MAKE THE DIFFERENCE FOR 5G BASE STATION ANTENNA APPLICATIONS Increased Design Flexibility – Can increase design flexibility especially for circuit design, 3D antenna design, and complex shapes Faster Design Qualification & Shorter Lead Time – Can be customized to specific Dk values and delivered within weeks Flexible Design Space – Effective for circuit designs constrained by a limited space Compatible with SMT Process – Can be customized to resist heat, with deflection temperatures ranging from 200°C to 278°C To learn more, please visit www.avient.com or call +86.21.60284888. www.avient.com Copyright © 2020, Avient Corporation.

Edgetek™ 3D/LDS Solutions Advanced PC, PPS and LCP formulations to help customers to build 3D circuits on molded part surfaces; supporting high design flexibilty, multi-function integration, size miniaturization and weight reduction, even in high heat processes such as SMT Customizable polymeric materials to meet specific Dk (Dielectric Constant) /Df (Dissipation Factor) values, including formulations that are compatible with the surface-mount technology (SMT) process and can be used to create 3D circuit boards for 5G equipment.

Explore 3D Printing 3D printing is having an impact on our world - learn how it can impact your business today

Explore 3D Printing 3D printing is having an impact on our world - learn how it can impact your business today