Customizable polymeric materials to meet specific Dk (Dielectric Constant) /Df (Dissipation Factor) values, including formulations that are compatible with the surface-mount technology (SMT) process and can be used to create 3D circuit boards for 5G equipment. Overview of technologies, characteristics, and applications.

Explore our broad portfolio of composite technologies. Avient’s reinforced composite technologies use carbon, glass and aramid fibers with custom formulated thermoset or thermoplastic resins in continuous forming processes

Back Home // Products // Advanced Composites // Pultrusion and Continuous Filament Winding Technology // Glasforms™ Pultruded Rods, Tubes & Custom Profiles Avient’s reinforced composite technologies use carbon, glass and aramid fibers with custom formulated thermoset or thermoplastic resins in continuous forming processes

Sustainable Fiber Coloration Technology (Spin-Dyeing) Cesa™ Aversive Technology

Pharma Packaging Technology Technologies

Microsoft Word - Avient_SecurityPolicy_2020 SECURITY POLICY Avient Corporation places a high priority on protecting the security of our people, our buildings and equipment, and our proprietary information, technology and systems.

MAJOR TELECOM COMPANY L D S A N T E N N A A R R A Y • Required material suitable for Laser Direct Structuring (LDS) for a 3D antenna design that allowed Surface Mount Technology (SMT) for mass production in a short manufacturing time • 265°C /10 seconds • Provided high-heat material to enable miniaturization and multi-function integration for an innovative 3D design • Formulated LDS solution with low dielectric constant (Dk 3.98) and dissipation factor (Df 0.006) values Edgetek™ ET9600-8015 Formulation KEY REQUIREMENTS WHY AVIENT AVIENT SOLUTION DESIGN FREEDOM + SMT LEARN MORE Copyright © 2021, Avient Corporation.

LUXURY PACKAGING MANUFACTURER S P I R I T B O T T L E C A P S • Specific gravity of 1.6 • EU and FDA compliant material • ABS-based material suitable for electroplating • Delivered a customized density polymer that supported electroplating, resulting in both the look and feel of metal • Demonstrated experience and expertise in density-modified material technology and electroplating to reach application goals quickly and cost-effectively Gravi-Tech™ Density Modified Formulation KEY REQUIREMENTS WHY AVIENT?

AFTERMARKET PARTS MANUFACTURER M O T O R M O U N T • Reduced part weight with retained performance • High strength • Corrosion resistance • Fatigue resistance • Facilitated lightweighting with a long glass fiber PA66 composite that matched the performance of the incumbent metal part • Met strength and corrosion requirements while achieving cost savings and reduced processing steps versus a die cast aluminum part • Relieved performance fears with mold flow analysis and hands-on technology support • Sampled quickly to accelerate speed to market KEY REQUIREMENTS METAL REPLACEMENT LEARN MORE WHY AVIENT?

SECURITY POLICY Avient Corporation places a high priority on protecting the security of our people, our buildings and equipment, and our proprietary information, technology and systems.