https://www.avient.com/idea/power-tool-manufacturer-reduces-production-overhead
The manufacturer began working with Avient to find a thermoplastic elastomer (TPE) solution to meet its dual requirements.
Navigating the Challenges of Semiconductor Packaging with Specialty Polymer Solutions
Navigating the Challenges of Semiconductor Packaging with Specialty Polymer Solutions
https://www.avient.com/products/long-fiber-technology/complet-long-hybrid-fiber
When selecting a hybrid solution there is also the added benefit of being able to promote the use of carbon fiber within your product – something that consumers are already well-versed with and associate with innovative and high-performance products.
High stiffness and strength of carbon fiber at a more palatable price
https://www.avient.com/idea/boosting-rpet-quality-and-safety-packaging
One example is Avient’s patented AA scavenger, ColorMatrix™ AAnchor™ Acetaldehyde Scavenger, developed to mitigate the issues associated with ATA-based solutions.
Navigating the Challenges of Semiconductor Packaging with Specialty Polymer Solutions
Navigating the Challenges of Semiconductor Packaging with Specialty Polymer Solutions
https://www.avient.com/sites/default/files/2023-03/Fiber-Line Global Product Selection Guide.pdf
FIBER-LINE™
High Performance
Synthetic Fibers
PRODUCT SELECTION GUIDE
FIBER-LINE™ HIGH PERFORMANCE SYNTHETIC FIBERS
Kevlar® Para-Aramid
Nomex®
Meta-Aramid
Vectran® LCP Zylon® PBO
Carbon
Fiber
UHMWPE PET Polyester Fiberglass Novoloid
Technora®
Filament Yarn
TECHNICAL PROPERTIES Standard Modulus
High
Modulus
Standard
Modulus
Standard
Modulus
High
Modulus
Standard
Modulus
High
Modulus
Standard
Modulus
Standard
Modulus
High
Modulus
High
Tenacity
Low
Shrink
E-Glass S-Glass
Standard
Modulus
Standard
Modulus
Breaking Tenacity (g/d) 23.0 23.6 5.0 23.0 30.0 42.0 42.0 23.0 28.0 38 9.3 8.4 6.0 - 7.3 6.7 - 9.4 1.5 28.0
Specific Gravity (Ratio) 1.44 1.44 1.38 1.40 1.40 1.54 1.56 1.80 0.97 0.97 1.38 1.38 2.58 2.48 1.27 1.39
Elongation at Break (%) 3.5 2.5 30.0 3.8 2.8 3.5 2.5 1.5 3.5 3.1 14.6 19.5 3.5 5.5 30.0 - 40.0 4.6
Tensile Modulus (g/d) 555 885 125 600 830 1200 1800 1480 850 1250 120 70 200–275 140–170 2.5–5.0 590
Equilibrium Moisture Regain
at 55% RH (%)
5.0 5.0 4.5
Technora® is a trademark of Teijin Kabushiki Kaisha.
1.844.4AVIENT
www.avient.com
Copyright © 2021, Avient Corporation.
Avient makes no warranties or
guarantees respecting suitability of either Avient’s products or the information for your process or end-use application.
https://www.avient.com/idea/advanced-composites-ballistic-protection
READ MORE ABOUT HOW AVIENT SOLUTIONS PROVIDE SAFETY AND SECURITY:
Navigating the Challenges of Semiconductor Packaging with Specialty Polymer Solutions
Navigating the Challenges of Semiconductor Packaging with Specialty Polymer Solutions
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