https://www.avient.com/sites/default/files/2024-11/Terms and Conditions of Sale for Canada.pdf
The parties agree that Seller need not further object to
any specific terms and conditions set by Buyer; such failure to object
to Buyer’s specific terms and conditions is not an acceptance of any
such terms and conditions.
Except for the express representation and warranty set out
above, Seller makes no representation or warranty of any kind
with respect to the Product, express or implied, including, but
not limited to, implied warranties of merchantable quality or
fitness for any particular purpose, whether used alone or in
combination with any other material or in any process, and
neither party has relied on any statement outside of these terms.
Buyer shall have no right of set-off.
https://www.avient.com/sites/default/files/2020-12/sem-tri-fold-selection-guide.pdf
a wholly-owned subsidiary of Avient Corporation
NAME BASE RESIN(S) AVAILABLE FEATURES1
Trilliant™
ABS, LCP, PA, PC,
ABS, PA 6, PA 66,
PC/ABS, PC/PSU,
PEBA, PEEK, PES,
POM, PPA, PSU
Certified to USP Class VI
Formulations locked down
Drug master file submissions by product stewardship
Pre-colored, small lot production down to 50 lb–250 lb
Sterilization, chemical resistance, and secondary process guidance
Adherence to FDM-GMP manufacturing standards
Antimicrobial technologies
Materials for radiation shielding protection
NEU™
Specialty
Materials2
PEBA, TPU, PA 11, PA 12,
PP, PE, TPE
Radiopacifiers, stabilizers, and surface modifiers
Antimicrobial technologies
Pre-colored formulations
Small lot capabilities
Short lead times
Versaflex™ HC TPE
Overmolding
Clear and heat resistant
Ultra clear grades
Ultra soft TPE gels, 30 shore OO
FDA, USP Class VI, ISO 10993 approved grades
Sterilizable under autoclave, radiation, and EtO gas
Extrusion, injection, and blow moldable
HEALTHCARE SPECIALTY THERMOPLASTICS
NAME BASE RESIN(S) TARGET MARKETS AVAILABLE FEATURES1
reSound™ R
Recycled
Formulations
PA6, PA66, PC
Transportation, Consumer,
Household Appliance,
Electrical & Electronics,
Industrial
PA grades: Up to 100% recycled content
PC grades: Up to 70% recycled content
PIR and PCR grades available
Support the circular economy
Comparable performance to prime grades
Customizable solution
Surround™ ABS, PP, PBT, PC, PA 66
Transportation, Electrical
& Electronics
Integrated EMI/RFI shielding
Long fiber technology
Conductive properties
Galvanic corrosion protection
Lightweighting and ease of processing
Stat-Tech™
ABS, PA, PC, PC/ABS,
PC/PSU, PEEK, PEI,
PES, PP, PPA
Transportation, Electrical
& Electronics
Integrated EMI/RFI shielding
Conductive properties
Anti-static/dissipative properties
Corrosion resistance
Lightweighting and ease of processing
Clean room materials for semiconductors available
Therma-Tech™
LCP, PA, PEEK, PP,
PPA, PPS
Consumer, Transportation
Thermally conductive
Low coefficient of thermal expansion
Corrosion resistance
SPECIALTY ENGINEERED THERMOPLASTICS
NAME BASE RESIN(S) TARGET MARKETS AVAILABLE FEATURES1
Barricade™
Elastomers
with Fortrex™
Technology
Barricade™ high-performance
elastomers bring next genera-
tion technology to market to
bridge the gap between tradi-
tional TPEs and silicone
Healthcare, Industrial
Aerospace, Appliances,
Electronics
High temperature compression set
Processes on thermoplastic injection molding
and extrusion equipment
Customizable and colorable
Process simplicity
CROSSLINKABLE ELASTOMERS
Barricade formulations leverage licensed Fortrex™ technology.
Transportation,
Building & Construction,
Electrical & Electronics,
Industrial, Wire & Cable
High heat resistance
Chemical resistance
Automotive approved grades
Excellent compression set
Overmolding
Flame resistant grades
Excellent weatherability
Extrusion, injection, and blow moldable
reSound™ OM
Bio-based
Thermoplastic
Elastomers
reSound™ OM TPEs are based
on biopolymers derived from
sugarcane utilizing 35 to 50
percent bio-renewable content
Consumer,
Transportation, Industrial
Sustainably resourced
Recycled content
Bio derived content
Strength and durability
Chemical resistance
Impact resistance
Pre-color solutions
reSound™ R
Recycled
Thermoplastic
Elastomers*
reSound™ R VX post-industrial
recycle (PIR) and post-consumer
recycle (PCR) TPEs help brand
owners create sustainable end-
user products, with formulations
utilizing 25 and 40 percent
recycled content.
https://www.avient.com/sites/default/files/2023-09/SEM Services Capabilities Overview Brochure.pdf
Material Data Sets
• A number of material characterization data sets
are available in .udb, moldex 3D, xChange data
cards, and SIPOE format
Mold Filling Simulation (see examples below)
• Serves to validate part design (e.g., gate location,
fill/pack/warp/cool) & material solution
• Evaluates component design viability with
preferred Avient material solution
• Fiber analysis determines fiber orientation
and length
• Predicts part quality and manufacturability
(shrink, warp, weld line location)
FILLING PART QUALITYFIBER ORIENTATION
Finite Element Analysis (FEA)
• Virtually simulates how an application will perform in real-world conditions with a high
level of precision
• Able to represent a variety of problems, test methods, models and outputs to evaluate the design,
process and material combination for validation or optimization
• Dynamic
- Acceleration
- Impact
- Break/no break
- Transmitted force
- Energy absorption
• Thermal Mechanical
- Temperature Computational Fluid Dynamics (CFD)
- Heat path
- Dominant heat transfer
- Temperature mapping
- Coupling with mechanical simulations
FEA Simulation Capabilities
• Static
- Displacement/rotations
- Stress and strains
- Contact pressure
- Reaction forces/moments
- Factors of safety
• Vibration
- Eigen frequencies
- Harmonic response
○ Harmonic
displacement,
acceleration and stress
Software Used
• Autodesk Moldflow
• Digimat
• Simulia/Abaqus
• MSC Cradle
• CAD/CAE
- MSC Apex
- SolidWorks
Failure Mode Effect Analysis (FMEA) Support
By leveraging mold filling simulation,
multiphysics simulation, and the understanding
of the link between design, process and material,
we can help inform your decision-making
process for product development.