Resin impregnated fibers are chemically cured with thermal or ultraviolet energy to form a highly crosslinked thermoset matrix.

Resin impregnated, continuous glass fibers are drawn through a curing die of a specific cross section, yielding consistent quality, dimensions and mechanical properties to provide more consistent spring rates than alternate materials.

FEATURES • Ambient curing • Flame performance • Resistant to heat, oil, creep and abrasion • Low temperature properties • Temperature ratings up to 125°C • Low capital investment • High extrusion speeds • UL/CSA bulletins 1.844.4AVIENT www.avient.com Copyright © 2023, Avient Corporation.

In contrast to VARTM panels, which are highly labor intensive and require extended curing, PolyOne panels come ready to install.

Surface Modification Additives for Silicone Reduce tackiness and enhance smoothness of the cured silicone compound for healthcare applications such as medical tubing, catheters, and medical equipment.

End of Fill Part Length Dynamic Pressure Hydrostatic Pressure P re ss u re Gate End Part FIGURE 61 - Deflection Equations H F WLMax Deflection: 0.002" (0.05mm) 1 = W • H3 12 _______ bending = F • L3 48 • E • I _______ 4 πtc = h2 1n π2 • a • Tmelt – Tcoolant Teject – Tcoolant tc = D2 1.61n 23.1 • a Tmelt – Tcoolant Teject – Tcoolant a = k p * Cp Qmoldings = mmoldings • Cp • Tme • Cplt – Teject cooling nlines moldings tc cooling Vcoolant line nmax, coolant • Pcoolant • Cp, coolant Dmax = 4 • Pcoolant • Vcoolant π • µcoolant • 4000 Dmin = Pcoolant • Lline • V2 coolant 5 10π • ∆Pline 4 πtc = h2 1n π2 • a • Tmelt – Tcoolant Teject – Tcoolant tc = D2 1.61n 23.1 • a Tmelt – Tcoolant Teject – Tcoolant a = k p * Cp Qmoldings = mmoldings • Cp • Tme • Cplt – Teject cooling nlines moldings tc cooling Vcoolant line nmax, coolant • Pcoolant • Cp, coolant Dmax = 4 • Pcoolant • Vcoolant π • µcoolant • 4000 Dmin = Pcoolant • Lline • V2 coolant 5 10π • ∆Pline 4 πtc = h2 1n π2 • a • Tmelt – Tcoolant Teject – Tcoolant tc = D2 1.61n 23.1 • a Tmelt – Tcoolant Teject – Tcoolant a = k p * Cp Qmoldings = mmoldings • Cp • Tme • Cplt – Teject cooling nlines moldings tc cooling Vcoolant line nmax, coolant • Pcoolant • Cp, coolant Dmax = 4 • Pcoolant • Vcoolant π • µcoolant • 4000 Dmin = Pcoolant • Lline • V2 coolant 5 10π • ∆Pline FIGURE 60 - Pressure vs Part Length FIGURE 61 - Deflection equations FIGURE 62 - For Plate Shaped Parts FIGURE 63 - For Cylindrical Shaped Parts Design Guide 49 • MMoldings = Combined mass of molded parts • Cp = Specific Heat of the material Step 3 – Heat Removal Rate • Nlines = The total number of independent cooling lines there are in the mold • tc = The cooling time required by the part (Determined in step 1) Step 4 – Coolant Volumetric Flow Rate • ΔTMax,Coolant = Change in coolant Temperature During Molding (1°C) • ρCoolant = Density of coolant • CP = Specific heat of coolant Step 5 – Determine Cooling Line Diameter • ρCoolant = Density of coolant • VCoolant = Volumetric flow rate of coolant • μCoolant = Viscosity of coolant • ΔPline = Max pressure drop per line (Usually equals half of the pump capacity) • LLine = Length of the cooling lines COOLING LINE SPACING 4 πtc = h2 1n π2 • a • Tmelt – Tcoolant Teject – Tcoolant tc = D2 1.61n 23.1 • a Tmelt – Tcoolant Teject – Tcoolant a = k p * Cp Qmoldings = mmoldings • Cp • Tme • Cplt – Teject cooling nlines moldings tc cooling Vcoolant line nmax, coolant • Pcoolant • Cp, coolant Dmax = 4 • Pcoolant • Vcoolant π • µcoolant • 4000 Dmin = Pcoolant • Lline • V2 coolant 5 10π • ∆Pline 4 πtc = h2 1n π2 • a • Tmelt – Tcoolant Teject – Tcoolant tc = D2 1.61n 23.1 • a Tmelt – Tcoolant Teject – Tcoolant a = k p * Cp Qmoldings = mmoldings • Cp • Tme • Cplt – Teject cooling nlines moldings tc cooling Vcoolant line nmax, coolant • Pcoolant • Cp, coolant Dmax = 4 • Pcoolant • Vcoolant π • µcoolant • 4000 Dmin = Pcoolant • Lline • V2 coolant 5 10π • ∆Pline 4 πtc = h2 1n π2 • a • Tmelt – Tcoolant Teject – Tcoolant tc = D2 1.61n 23.1 • a Tmelt – Tcoolant Teject – Tcoolant a = k p * Cp Qmoldings = mmoldings • Cp • Tme • Cplt – Teject cooling nlines moldings tc cooling Vcoolant line nmax, coolant • Pcoolant • Cp, coolant Dmax = 4 • Pcoolant • Vcoolant π • µcoolant • 4000 Dmin = Pcoolant • Lline • V2 coolant 5 10π • ∆Pline 4 πtc = h2 1n π2 • a • Tmelt – Tcoolant Teject – Tcoolant tc = D2 1.61n 23.1 • a Tmelt – Tcoolant Teject – Tcoolant a = k p * Cp Qmoldings = mmoldings • Cp • Tme • Cplt – Teject cooling nlines moldings tc cooling Vcoolant line nmax, coolant • Pcoolant • Cp, coolant Dmax = 4 • Pcoolant • Vcoolant π • µcoolant • 4000 Dmin = Pcoolant • Lline • V2 coolant 5 10π • ∆Pline 4 πtc = h2 1n π2 • a • Tmelt – Tcoolant Teject – Tcoolant tc = D2 1.61n 23.1 • a Tmelt – Tcoolant Teject – Tcoolant a = k p * Cp Qmoldings = mmoldings • Cp • Tme • Cplt – Teject cooling nlines moldings tc cooling Vcoolant line nmax, coolant • Pcoolant • Cp, coolant Dmax = 4 • Pcoolant • Vcoolant π • µcoolant • 4000 Dmin = Pcoolant • Lline • V2 coolant 5 10π • ∆Pline 4 πtc = h2 1n π2 • a • Tmelt – Tcoolant Teject – Tcoolant tc = D2 1.61n 23.1 • a Tmelt – Tcoolant Teject – Tcoolant a = k p * Cp Qmoldings = mmoldings • Cp • Tme • Cplt – Teject cooling nlines moldings tc cooling Vcoolant line nmax, coolant • Pcoolant • Cp, coolant Dmax = 4 • Pcoolant • Vcoolant π • µcoolant • 4000 Dmin = Pcoolant • Lline • V2 coolant 5 10π • ∆Pline 2D < H line < 5D H line < W line < 2H line FIGURE 70 - Cooling Line Spacing FIGURE 64 - Heat Transfer Equation FIGURE 65 - Total Cooling for Mold FIGURE 66 - Cooling Required by Each Line FIGURE 68 - Max Diameter Equation FIGURE 69 - Min Diameter Equation FIGURE 67 - Volumetric Flow Rate Equation 50 Gravi-Tech ADHESIVE ADVANTAGES DISADVANTAGES Cyanoacrylate Rapid, one-part process Various viscosities Can be paired with primers for polyolefins Poor strength Low stress crack resistance Low chemical resistance Epoxy High strength Compatible with various substrates Tough Requires mixing Long cure time Limited pot life Exothermic Hot Melt Solvent-free High adhesion Different chemistries for different substrates High temp dispensing Poor high temp performance Poor metal adhesion Light Curing Acrylic Quick curing One component Good environmental resistance Oxygen sensitive Light source required Limited curing configurations Polyurethane High cohesive strength Impact and abrasion resistance Poor high heat performance Requires mixing Silicone Room temp curing Good adhesion Flexible Performs well in high temps Low cohesive strength Limited curing depth Solvent sensitive No-Mix Acrylic Good peel strength Fast cure Adhesion to variety of substrates Strong odor Exothermic Limited cure depth Design Guide 51 Bibliography 1.

Certain things cannot be controlled by the printer: • The dye in the shirt • The humidity in the air and shirt Things that can be controlled are: • The type of ink – cotton white for cotton, non-ghosting bleed resistant for polyester • The amount of heat used on the garment—cure at the recommended temp, not over • Stack in separate piles to allow cooling—fold in dozens separately, wait to pack Be aware of at-risk colors; brown, tan and beige are the most sensitive to possible ghosting. www.avient.com Copyright © 2020, Avient Corporation.

This leading portfolio of fiber solutions is developed through advancements in tensioning equipment, coating/wiping tooling, and curing technology.

End of Fill Part Length Dynamic Pressure Hydrostatic Pressure P re ss u re Gate End Part FIGURE 61 - Deflection Equations H F WLMax Deflection: 0.002" (0.05mm) 1 = W • H3 12 _______ bending = F • L3 48 • E • I _______ 4 πtc = h2 1n π2 • a • Tmelt – Tcoolant Teject – Tcoolant tc = D2 1.61n 23.1 • a Tmelt – Tcoolant Teject – Tcoolant a = k p * Cp Qmoldings = mmoldings • Cp • Tme • Cplt – Teject cooling nlines moldings tc cooling Vcoolant line nmax, coolant • Pcoolant • Cp, coolant Dmax = 4 • Pcoolant • Vcoolant π • µcoolant • 4000 Dmin = Pcoolant • Lline • V2 coolant 5 10π • ∆Pline 4 πtc = h2 1n π2 • a • Tmelt – Tcoolant Teject – Tcoolant tc = D2 1.61n 23.1 • a Tmelt – Tcoolant Teject – Tcoolant a = k p * Cp Qmoldings = mmoldings • Cp • Tme • Cplt – Teject cooling nlines moldings tc cooling Vcoolant line nmax, coolant • Pcoolant • Cp, coolant Dmax = 4 • Pcoolant • Vcoolant π • µcoolant • 4000 Dmin = Pcoolant • Lline • V2 coolant 5 10π • ∆Pline 4 πtc = h2 1n π2 • a • Tmelt – Tcoolant Teject – Tcoolant tc = D2 1.61n 23.1 • a Tmelt – Tcoolant Teject – Tcoolant a = k p * Cp Qmoldings = mmoldings • Cp • Tme • Cplt – Teject cooling nlines moldings tc cooling Vcoolant line nmax, coolant • Pcoolant • Cp, coolant Dmax = 4 • Pcoolant • Vcoolant π • µcoolant • 4000 Dmin = Pcoolant • Lline • V2 coolant 5 10π • ∆Pline FIGURE 60 - Pressure vs Part Length FIGURE 61 - Deflection equations FIGURE 62 - For Plate Shaped Parts FIGURE 63 - For Cylindrical Shaped Parts Design Guide 49 • MMoldings = Combined mass of molded parts • Cp = Specific Heat of the material Step 3 – Heat Removal Rate • Nlines = The total number of independent cooling lines there are in the mold • tc = The cooling time required by the part (Determined in step 1) Step 4 – Coolant Volumetric Flow Rate • ΔTMax,Coolant = Change in coolant Temperature During Molding (1°C) • ρCoolant = Density of coolant • CP = Specific heat of coolant Step 5 – Determine Cooling Line Diameter • ρCoolant = Density of coolant • VCoolant = Volumetric flow rate of coolant • μCoolant = Viscosity of coolant • ΔPline = Max pressure drop per line (Usually equals half of the pump capacity) • LLine = Length of the cooling lines COOLING LINE SPACING 4 πtc = h2 1n π2 • a • Tmelt – Tcoolant Teject – Tcoolant tc = D2 1.61n 23.1 • a Tmelt – Tcoolant Teject – Tcoolant a = k p * Cp Qmoldings = mmoldings • Cp • Tme • Cplt – Teject cooling nlines moldings tc cooling Vcoolant line nmax, coolant • Pcoolant • Cp, coolant Dmax = 4 • Pcoolant • Vcoolant π • µcoolant • 4000 Dmin = Pcoolant • Lline • V2 coolant 5 10π • ∆Pline 4 πtc = h2 1n π2 • a • Tmelt – Tcoolant Teject – Tcoolant tc = D2 1.61n 23.1 • a Tmelt – Tcoolant Teject – Tcoolant a = k p * Cp Qmoldings = mmoldings • Cp • Tme • Cplt – Teject cooling nlines moldings tc cooling Vcoolant line nmax, coolant • Pcoolant • Cp, coolant Dmax = 4 • Pcoolant • Vcoolant π • µcoolant • 4000 Dmin = Pcoolant • Lline • V2 coolant 5 10π • ∆Pline 4 πtc = h2 1n π2 • a • Tmelt – Tcoolant Teject – Tcoolant tc = D2 1.61n 23.1 • a Tmelt – Tcoolant Teject – Tcoolant a = k p * Cp Qmoldings = mmoldings • Cp • Tme • Cplt – Teject cooling nlines moldings tc cooling Vcoolant line nmax, coolant • Pcoolant • Cp, coolant Dmax = 4 • Pcoolant • Vcoolant π • µcoolant • 4000 Dmin = Pcoolant • Lline • V2 coolant 5 10π • ∆Pline 4 πtc = h2 1n π2 • a • Tmelt – Tcoolant Teject – Tcoolant tc = D2 1.61n 23.1 • a Tmelt – Tcoolant Teject – Tcoolant a = k p * Cp Qmoldings = mmoldings • Cp • Tme • Cplt – Teject cooling nlines moldings tc cooling Vcoolant line nmax, coolant • Pcoolant • Cp, coolant Dmax = 4 • Pcoolant • Vcoolant π • µcoolant • 4000 Dmin = Pcoolant • Lline • V2 coolant 5 10π • ∆Pline 4 πtc = h2 1n π2 • a • Tmelt – Tcoolant Teject – Tcoolant tc = D2 1.61n 23.1 • a Tmelt – Tcoolant Teject – Tcoolant a = k p * Cp Qmoldings = mmoldings • Cp • Tme • Cplt – Teject cooling nlines moldings tc cooling Vcoolant line nmax, coolant • Pcoolant • Cp, coolant Dmax = 4 • Pcoolant • Vcoolant π • µcoolant • 4000 Dmin = Pcoolant • Lline • V2 coolant 5 10π • ∆Pline 4 πtc = h2 1n π2 • a • Tmelt – Tcoolant Teject – Tcoolant tc = D2 1.61n 23.1 • a Tmelt – Tcoolant Teject – Tcoolant a = k p * Cp Qmoldings = mmoldings • Cp • Tme • Cplt – Teject cooling nlines moldings tc cooling Vcoolant line nmax, coolant • Pcoolant • Cp, coolant Dmax = 4 • Pcoolant • Vcoolant π • µcoolant • 4000 Dmin = Pcoolant • Lline • V2 coolant 5 10π • ∆Pline 2D < H line < 5D H line < W line < 2H line FIGURE 70 - Cooling Line Spacing FIGURE 64 - Heat Transfer Equation FIGURE 65 - Total Cooling for Mold FIGURE 66 - Cooling Required by Each Line FIGURE 68 - Max Diameter Equation FIGURE 69 - Min Diameter Equation FIGURE 67 - Volumetric Flow Rate Equation 50 Gravi-Tech ADHESIVE ADVANTAGES DISADVANTAGES Cyanoacrylate Rapid, one-part process Various viscosities Can be paired with primers for polyolefins Poor strength Low stress crack resistance Low chemical resistance Epoxy High strength Compatible with various substrates Tough Requires mixing Long cure time Limited pot life Exothermic Hot Melt Solvent-free High adhesion Different chemistries for different substrates High temp dispensing Poor high temp performance Poor metal adhesion Light Curing Acrylic Quick curing One component Good environmental resistance Oxygen sensitive Light source required Limited curing configurations Polyurethane High cohesive strength Impact and abrasion resistance Poor high heat performance Requires mixing Silicone Room temp curing Good adhesion Flexible Performs well in high temps Low cohesive strength Limited curing depth Solvent sensitive No-Mix Acrylic Good peel strength Fast cure Adhesion to variety of substrates Strong odor Exothermic Limited cure depth Design Guide 51 Bibliography 1.

LV Insulation XLS 8001 7.5 14 160 33 Ambient curing Sioplas solutions with excellent cross- linking, surface finish and processing speed.