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https://www.avient.com/sites/default/files/2024-10/Final 2_Avient Semicondcutor Packaging Case Study Snapshot 2024.pdf
SEMICONDUCTOR
PACKAGING OEM
S P E C I A L T Y , S T A T I C
D I S S I P A T I V E P A C K A G I N G
• Provide protection against electrostatic discharge (ESD) and environmental
variations
• Ensure highly specialized, clean manufacturing conditions
• Deliver stringent quality control of ionic and metal contamination
• Maintain availability of raw materials across a global supply chain
• Ability to translate production globally
• Protected critical electronics from ESD while providing
an environmental barrier
• Adhered to strict quality and cleanliness controls from
raw material handling through production to help
maintain high-purity standards, such as ultra-clean
feeders, deionized water, and specific HVAC systems,
supporting quality initiatives, including PCS reviews,
eCoA, and HA assessments
• Exceeded customer expectations for controlling ionic
and metal contamination down to parts per billion (PPB)
• Offered global capabilities with local support and material
supply to meet growing semiconductor industry needs
Stat-Tech Static Dissipative Formulations
KEY REQUIREMENTS
WHY AVIENT?
AVIENT SOLUTIONS
QUALITY CONTROL + PERFORMANCE
LEARN MORE
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