Advanced Composites Advanced Composites Explained Advanced Composite Springs

The company noted customers are citing concerns over tariffs and persistent inflation as possible drivers of these demand conditions, which most heavily impacted the Performance Products and Solutions (PP&S) and Distribution segments.  We undertake no obligation to publicly update forward-looking statements, whether as a result of new information, future events or otherwise.

Stephan, and Avient Corporation, “EMI/RFI Shielding Formulations for Use in Advanced Electronic Systems” (2014). Other keys to molding electrically conductive compounds are slow injection speeds and low back pressure (e.g., 50 psi).1 Use 50 percent to 75 percent of the injection pressure for the pack and hold pressure. In the mold, use general purpose nozzles (not tapered nozzles) and large, free-flow gates.

MEVOPUR COLORANTS • Standard colors in PP and PE to shorten time-to-market • Custom colors matched to Pantone, RAL or other color reference • White colorants for pharmaceutical packaging for LDPE, HDPE and PP with opacity to reach USP chapter MEVOPUR FUNCTIONAL ADDITIVES • Antistatic formulation with good flow/impact for injection molding • Amide- and amine-free antistatic for film in contact with API (Active Pharmaceutical Ingredients) • UV blocking for transparent PP and PE packaging to meet USP chapter • Non-migrating friction reduction/processing aid for PE and PP • Laser marking/welding additive for fast, reliable marking/assembly • MVTR (Moisture Vapor Transmission Rate) reduction for HDPE to improve shelf-life • Thermal protection of the polymer during processing • Gamma/e-beam sterilization protection for PP (up to 50kGy) with color compensation for reduced yellowing REGULATORY SUPPORT • Raw materials tested to: - ISO 10993-1 and USP biological evaluation - European Pharmacopeia 3.1.3/3.1.5 (polyolefin) - USP (polyethylene) - ICH Q3D elemental impurities • Registered Drug Master File (Type III) and/or Device Master File • Food contact established with FDA/EU* APPLICATION BULLETIN * FDA/EU compliance information available upon request Bormed™ is a registered trademark of Borealis Healthcare use limitations apply—see below.

Cesa™ Stat OCA0025695 reduces electric charges with a sustainable antistatic effect and keeps the surface dust-free and clean.

Stephan, and Avient Corporation, “EMI/RFI Shielding Formulations for Use in Advanced Electronic Systems” (2014). Other keys to molding electrically conductive compounds are slow injection speeds and low back pressure (e.g., 50 psi).1 Use 50 percent to 75 percent of the injection pressure for the pack and hold pressure. In the mold, use general purpose nozzles (not tapered nozzles) and large, free-flow gates.

Stephan, and Avient Corporation, “EMI/RFI Shielding Formulations for Use in Advanced Electronic Systems” (2014). Other keys to molding electrically conductive compounds are slow injection speeds and low back pressure (e.g., 50 psi).1 Use 50 percent to 75 percent of the injection pressure for the pack and hold pressure. In the mold, use general purpose nozzles (not tapered nozzles) and large, free-flow gates.

Stephan, and Avient Corporation, “EMI/RFI Shielding Formulations for Use in Advanced Electronic Systems” (2014). Other keys to molding electrically conductive compounds are slow injection speeds and low back pressure (e.g., 50 psi).1 Use 50 percent to 75 percent of the injection pressure for the pack and hold pressure. In the mold, use general purpose nozzles (not tapered nozzles) and large, free-flow gates.

Stephan, and Avient Corporation, “EMI/RFI Shielding Formulations for Use in Advanced Electronic Systems” (2014). Other keys to molding electrically conductive compounds are slow injection speeds and low back pressure (e.g., 50 psi).1 Use 50 percent to 75 percent of the injection pressure for the pack and hold pressure. In the mold, use general purpose nozzles (not tapered nozzles) and large, free-flow gates.

Stephan, and Avient Corporation, “EMI/RFI Shielding Formulations for Use in Advanced Electronic Systems” (2014). Other keys to molding electrically conductive compounds are slow injection speeds and low back pressure (e.g., 50 psi).1 Use 50 percent to 75 percent of the injection pressure for the pack and hold pressure. In the mold, use general purpose nozzles (not tapered nozzles) and large, free-flow gates.